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C-DOT, IIT Bombay sign pact for 'Chipset for High-Bandwidth 6G Wireless Links'

By TIOL News Service

NEW DELHI, JAN 17, 2025: IN the on-going process of developing indigenous hardware for next-generation telecommunications technology, Centre for Development of Telematics (C-DOT), the premier Telecom R&D centre of the Department of Telecommunications (DoT), Government of India, has signed an agreement with the Indian Institute of Technology, Bombay (IIT Bombay) for the development of "Optical Transceiver Chipset for High-Bandwidth 6G Wireless Links".

The agreement is signed under the Telecom Technology Development Fund (TTDF) 6G Call for proposal from the Department of Telecommunications, Government of India. This call for proposal is for accelerated research on 6G Eco-system, to lead in the design, development, and deployment of 6G technology by 2030 on the pillars of Affordability, Sustainability, and Ubiquity.

The aim of the project is to develop chipset for high-bandwidth free-space coherent optical links. These links are meant for 6G applications including last mile high-speed terrestrial connectivity in rural areas, and in terrains where deployment / laying out of optical fibres becomes a challenge. The objective is also to develop solutions for providing uninterrupted high bandwidth communication links to remote areas via satellites.

The agreement was signed during a ceremony attended by Dr. Rajkumar Upadhyay, the CEO, C-DOT, Prof. Shalabh Gupta, the principal investigator from IIT Bombay along with the Directors of C-DOT - Dr. Pankaj Kumar Dalela and Ms. Shikha Srivastava.

At the event, Dr. Rajkumar Upadhyay, CEO, C-DOT, underscored the key role of indigenously designed & developed technologies in meeting the specific requirements of communication in our diverse country, reaffirming the commitment towards fulfilling the vision of our Honourable Prime on "Atmanirbhar Bharat" and Bharat 6G.

Prof. Shalabh Gupta, Principal investigator from IIT Bombay, expressed gratitude to DOT and C-DOT for the opportunity to collaborate on this research, emphasizing that it bolsters efforts to enhance cutting-edge research capabilities and infrastructure in the telecom sector.


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